PECVD and Magnetron Sputtering Systems

Sputtering systems are high-powered machines that provide a diamond-like carbon film covering so thin, it only measures atoms thick. Popular sputtering deposition methods include Plasma-Enhanced Chemical Vapor Deposition. Material inside an air tight vacuum is heated at temperatures so high, it reaches a state of matter known as plasma.

Plasma occurs naturally inside our sun due to the high heat and energy environments. In matter’s solid state, atoms are tightly packed, while liquids allow atoms to move more freely. In a gaseous state, atoms have full range. In a plasma state, however, atoms become so excited that their electrons are able to move freely. This is what gives a sputtering machine operator the ability to create a film so hard, yet so thin. When the material cools, the vapors condense on the target substance, creating an even coating.

PECVD is not the only sputtering method available. Other forms of sputtering have also been developed, including E-beam Evaporation and magnetron sputtering. Magnetron sputtering is a relatively new method and has only been applied on a broad scale since 2006. The first patent was only made in 2001. Studies have shown that magnetron sputtering has a greater hardness ratio than that of conventional sputtering methods.

Sputtering methods are highly useful in a vast array of industries. Those who create products that must endure high heat, or high pressure environments find deposition coating particularly useful, including semi conductors. Sensitive medical equipment and optics can also be coated to prevent oxidization or damage due to abrasion.

Guest post is provided by Denton Vacuum, LLC. Sputtering systems from Denton provide a diamond like carbon coating. Find out more at www.dentonvacuum.com.